Contactless Material Identification with Millimeter Wave Vibrometry The 21st International Conference on Mobile Systems, Applications, and Services (MobiSys ’23), DOI: 10.1145/3581791.3596850 H. Shanbhag*, S. Madani*, A. Isanaka, D. Nair, S. Gupta, H. Hassanieh (* indicates equal contribution) Code available on Github, Slides